Devcon Wet Surface Repair Putty(UW)-11101

Devcon Wet Surface Repair Putty(UW)

Devcon Wet Surface Repair Putty (UW) is a non-rusting, two-part epoxy putty designed specifically to patch, repair, and rebuild machinery and equipment in wet or entirely submerged environments. It penetrates existing moisture to form a secure bond, making it unnecessary to completely dry the substrate before starting

Key Technical Specifications

  • Open Time: 45 minutes.
  • Full Cure Time: Hardens in 4 hours at 24°C; achieves a full cure in 16 hours.
  • Application Temperature: Functions and cures in temperatures as low as 4°C (40°F) up to 32°C (90°F).
  • Compressive Strength: 5,625 psi.
  • Gap Fill Capability: 0.0625 inches to 0.075 inches.
  • Packaging Sizes: 500g kits- Devcon 11801)
  • IMPA No.:812246
    Common Applications

    This underwater repair compound is widely used across heavy industrial sectors
    • Marine & Offshore: Fixing hulls, pipelines, and structures exposed to salt or fresh water.
    • Water Treatment: Rebuilding and sealing pumps, valves, and water tanks.
    • Industrial Facilities: Maintenance repairs in pulp and paper mills or mining operations.

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