Devcon Wet Surface Repair Putty(UW)
Devcon Wet Surface Repair Putty (UW) is a non-rusting, two-part epoxy putty designed specifically to patch, repair, and rebuild machinery and equipment in wet or entirely submerged environments. It penetrates existing moisture to form a secure bond, making it unnecessary to completely dry the substrate before starting
Key Technical Specifications
- Open Time: 45 minutes.
- Full Cure Time: Hardens in 4 hours at 24°C; achieves a full cure in 16 hours.
- Application Temperature: Functions and cures in temperatures as low as 4°C (40°F) up to 32°C (90°F).
- Compressive Strength: 5,625 psi.
- Gap Fill Capability: 0.0625 inches to 0.075 inches.
- Packaging Sizes: 500g kits- Devcon 11801)
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IMPA No.:812246Common ApplicationsThis underwater repair compound is widely used across heavy industrial sectors
- Marine & Offshore: Fixing hulls, pipelines, and structures exposed to salt or fresh water.
- Water Treatment: Rebuilding and sealing pumps, valves, and water tanks.
- Industrial Facilities: Maintenance repairs in pulp and paper mills or mining operations.





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